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WDC identification
6502 identification
Related links: 650x
| 1 | 2 | 3 | 4 | 5 | |||
| W | 65C02S | 8 | PL | -14 | |||
| 5. Frequency | |||||||
| -14 | 14 MHz | ||||||
| 4. Temperature range | |||||||
| No designation | Commercial range 0 - +70°C | ||||||
| 3. Package type | |||||||
| P | Plastic DIP | ||||||
| PL | Plastic Leaded Chip Carrier | ||||||
| Q | Quad Flat Pack | ||||||
| 2. Manufacturing process | |||||||
| No designation | 1.2u | ||||||
| 8 | 0.8u | ||||||
| 1. Part number | |||||||
| 65C02 | 65C02 microprocessor | ||||||
| 65C02C | 65C02 compatible processor with additional instructions | ||||||
| 65C02S | 65C02 compatible processor with additional instructions | ||||||
65816 (65C816) identification
Related links: 65816
| 1 | 2 | 3 | 4 | 5 | |||
| W | 65C816S | 6 | PL | -14 | |||
| 5. Frequency | |||||||
| -14 | 14 MHz | ||||||
| 4. Temperature range | |||||||
| No designation | 0 - +70°C for DIP, -40 - +85°C for PLCC and QFP | ||||||
| 3. Package type | |||||||
| P | Plastic DIP | ||||||
| PL | Plastic Leaded Chip Carrier | ||||||
| Q | Quad Flat Pack | ||||||
| 2. Manufacturing process | |||||||
| No designation | 1.2 micron | ||||||
| 8 | 0.8 micron | ||||||
| 6 | 0.6 micron | ||||||
| 1. Part number | |||||||
| 65C816S | 16-bit CMOS microprocessor | ||||||
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