Zilog identification
Z8000 | Z80L | Z80 (old naming convention) | Z80 (new naming convention) | Z8 | Z180 | Super-8 | V20 and V30
Z8000 identification
| | 1 | 2 | | 3 | 4 | 5 | |
| Z | 8001 | A | | C | L | B | |
| |
| 5. Screening |
| No designation | Standard screening |
| B | MIL-STD-883 class B |
| J | JAN 38510 class B |
| |
| | 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +85°C |
| L | Military range -55 - +110°C |
| M | Military range -55 - +125°C |
| |
| | | 3. Package type |
| C | Ceramic side-brazed DIP |
| D | Ceramic DIP |
| L | Ceramic LCC |
| P | Plastic DIP |
| V | Plastic LCC |
| |
| | | | | 2. Frequency |
| No designation | 4 MHz |
| A | 6 MHz |
| B | 10 MHz |
| |
| | | | | | 1. Part number |
| 8001 | Segmented CPU |
| 8002 | Non-segmented CPU |
| 8003 | Segmented virtual memory processing unit |
| 8004 | Non-segmented virtual memory processing unit |
| 8070 | Arithmetic processing unit |
Z80L identification
| | 1 | 2 | | 3 | 4 | 5 | |
| Z | 8300 | -1 | | P | S | x | |
| |
| 5. Screening |
| No designation | Standard screening |
| B | MIL-STD-883 class B |
| |
| | 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +85°C |
| M | Military range -55 - +125°C |
| |
| | | 3. Package type |
| C | Ceramic DIP |
| L | Ceramic LCC |
| P | Plastic DIP |
| V | Plastic LCC |
| |
| | | | | 2. Frequency |
| 1 | 1 MHz |
| 3 | 2.5 MHz |
| |
| | | | | | 1. Part number |
| 8300 | Z80L CPU |
Z80 (old naming convention) identification
| | 1 | 2 | | 3 | 4 | 5 | |
| Z | 8400 | A | | C | M | B | |
| |
| 5. Screening |
| No designation | Standard screening |
| B | MIL-STD-883 class B |
| J | JAN 38510 class B |
| |
| | 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +85°C |
| M | Military range -55 - +125°C |
| |
| | | 3. Package type |
| C | Ceramic side-brazed DIP |
| D | Ceramic DIP |
| L | Ceramic LCC |
| P | Plastic DIP |
| V | Plastic LCC |
| |
| | | | | 2. Frequency |
| Blank | 2.5 MHz |
| A | 4 MHz |
| B | 6 MHz |
| H | 8 MHz |
| |
| | | | | | 1. Part number |
| 8400 | Z80 microprocessor |
| 84C00 | CMOS version of Z80 processor |
Z80 (new naming convention) identification
| | 1 | 2 | 3 | 4 | 5 | |
| Z | 84C00 | 06 | P | S | C | |
| |
| 5. Environmental |
| A | Hermetic stressed |
| B | MIL STD 883 Class B |
| C | Plastic standard |
| D | Plastic stressed |
| E | Hermetic standard |
| F | Protopack standard |
| J | JAN 38510 |
| |
| | 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +100°C |
| M | Military range -55 - +125°C |
| |
| | | 3. Package type |
| D | Ceramic DIP |
| F | Plastic QFP |
| P | Plastic DIP |
| V | Plastic LCC |
| |
| | | | 2. Frequency |
| 04 | 4 MHz |
| 06 | 6.17 MHz |
| 08 | 8 MHz |
| 10 | 10 MHz |
| 20 | 20 MHz |
| |
| | | | | 1. Part number |
| 08400 | NMOS Z80 processor |
| 84C00 | CMOS Z80 processor |
Z8 identification
| | 1 | 2 | 3 | 4 | |
| Z | 8603 | -12 | P | S | |
| |
| 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +85°C |
| M | Military range -55 - +125°C |
| |
| | 3. Package type |
| C | Ceramic side-brazed DIP |
| D | Ceramic DIP |
| L | Ceramic LCC |
| P | Plastic DIP |
| R | Protopack |
| T | Low profile protopack |
| V | Plastic LCC |
| |
| | | 2. Frequency |
| No designation | 8 MHz for Z86xx, 4 MHz for Z80xx/Z85xx |
| -6 | 6 MHz |
| -12 | 12 MHz |
| |
| | | | 1. Part number |
| 8090 | Universal peripheral controller with 2 KB ROM (Z-Bus) |
| 8094 | Universal peripheral controller with PROM/RAM (Z-Bus) |
| 8590 | Universal peripheral controller with 2 KB ROM (non-multiplexed bus) |
| 8594 | Universal peripheral controller with PROM/RAM (non-multiplexed bus) |
| 8601 | Z8 MCU with 2 KB ROM |
| 8603 | Z8 prototyping MCU with external 2 KB EPROM |
| 8611 | Z8 MCU with 4 KB ROM |
| 8612 | Z8 MCU with 4 KB external ROM |
| 8613 | Z8 prototyping MCU with external 4 KB EPROM |
| 8671 | Z8 MCU with BASIC interpreter |
| 8681 | ROMless version of Z8 MCU |
| 8682 | ROMless version of Z8 MCU |
| 86L81 | Low-power ROMless version of Z8 MCU |
| 86L85 | Low-power ROMless version of Z8 MCU |
Z180 identification
| | 1 | 2 | 3 | 4 | 5 | |
| Z | 80180 | 06 | V | S | C | |
| |
| 5. Environmental flow |
| C | Plastic standard |
| |
| | 4. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +100°C |
| |
| | | 3. Package type |
| F | Plastic QFP |
| P | Plastic DIP |
| V | Plastic LCC |
| |
| | | | 2. Frequency |
| 06 | 6 MHz |
| 08 | 8 MHz |
| 10 | 10 MHz |
| 12 | 12 MHz |
| 15 | 15 MHz |
| 20 | 20 MHz |
| 33 | 33 MHz |
| |
| | | | | 1. Part number |
| 80180 | 80180 microcontroller |
| 8L180 | Low voltage version of Z180 microcontroller |
Super-8 identification
| | 1 | 2 | 3 | |
| Z | 8811 | P | S | |
| |
| 3. Temperature range |
| S | Commercial range 0 - +70°C |
| E | Extended range -40 - +85°C |
| M | Military range -55 - +125°C |
| |
| | 2. Package type |
| C | Ceramic DIP |
| L | Ceramic LCC |
| P | Plastic DIP |
| R | Protopack |
| T | Low profile protopack |
| V | Plastic LCC |
| |
| | | 1. Part number |
| 8801 | ROMless version of Super-8 MCU |
| 8811 | Super-8 MCU with 4 KB ROM |
| 8813 | Super-8 prototyping MCU with external 4 KB EPROM |
| 8821 | Super-8 MCU with 8 KB ROM |
| 8823 | Super-8 prototyping MCU with external 8 KB EPROM |
| 8831 | Super-8 MCU with 16 KB ROM |
| 8833 | Super-8 prototyping MCU with external 16 KB EPROM |
V20 and V30 identification
| | 1 | 2 | 3 | 4 | |
| Z | 70116 | -5 | D | S | |
| |
| 4. Temperature range |
| S | Commercial range 0 - +70°C |
| |
| | 3. Package type |
| D | Ceramic DIP |
| |
| | | 2. Frequency |
| -5 | 5 MHz |
| -8 | 8 MHz |
| |
| | | | 1. Part number |
| 70108 | V20 microprocessor |
| 70116 | V30 microprocessor (V20 with 16 bit data bus) |