Zilog identification
Z8000 | Z80L | Z80 (old naming convention) | Z80 (new naming convention) | Z8 | Z180 | Super-8 | V20 and V30
Z8000 identification
| |
1 |
2 |
|
3 |
4 |
5 |
|
| Z |
8001 |
A |
|
C |
L |
B |
|
| |
|
|
| 5. Screening |
| No designation |
|
Standard screening |
| B |
|
MIL-STD-883 class B |
| J |
|
JAN 38510 class B |
| |
| |
4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +85°C |
| L |
|
Military range -55 - +110°C |
| M |
|
Military range -55 - +125°C |
| |
| |
|
3. Package type |
| C |
|
Ceramic side-brazed DIP |
| D |
|
Ceramic DIP |
| L |
|
Ceramic LCC |
| P |
|
Plastic DIP |
| V |
|
Plastic LCC |
| |
| |
|
|
|
2. Frequency |
| No designation |
|
4 MHz |
| A |
|
6 MHz |
| B |
|
10 MHz |
| |
| |
|
|
|
|
1. Part number |
| 8001 |
|
Segmented CPU |
| 8002 |
|
Non-segmented CPU |
| 8003 |
|
Segmented virtual memory processing unit |
| 8004 |
|
Non-segmented virtual memory processing unit |
| 8070 |
|
Arithmetic processing unit |
Z80L identification
| |
1 |
2 |
|
3 |
4 |
5 |
|
| Z |
8300 |
-1 |
|
P |
S |
x |
|
| |
|
|
| 5. Screening |
| No designation |
|
Standard screening |
| B |
|
MIL-STD-883 class B |
| |
| |
4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +85°C |
| M |
|
Military range -55 - +125°C |
| |
| |
|
3. Package type |
| C |
|
Ceramic DIP |
| L |
|
Ceramic LCC |
| P |
|
Plastic DIP |
| V |
|
Plastic LCC |
| |
| |
|
|
|
2. Frequency |
| 1 |
|
1 MHz |
| 3 |
|
2.5 MHz |
| |
| |
|
|
|
|
1. Part number |
| 8300 |
|
Z80L CPU |
Z80 (old naming convention) identification
| |
1 |
2 |
|
3 |
4 |
5 |
|
| Z |
8400 |
A |
|
C |
M |
B |
|
| |
|
|
| 5. Screening |
| No designation |
|
Standard screening |
| B |
|
MIL-STD-883 class B |
| J |
|
JAN 38510 class B |
| |
| |
4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +85°C |
| M |
|
Military range -55 - +125°C |
| |
| |
|
3. Package type |
| C |
|
Ceramic side-brazed DIP |
| D |
|
Ceramic DIP |
| L |
|
Ceramic LCC |
| P |
|
Plastic DIP |
| V |
|
Plastic LCC |
| |
| |
|
|
|
2. Frequency |
| Blank |
|
2.5 MHz |
| A |
|
4 MHz |
| B |
|
6 MHz |
| H |
|
8 MHz |
| |
| |
|
|
|
|
1. Part number |
| 8400 |
|
Z80 microprocessor |
| 84C00 |
|
CMOS version of Z80 processor |
Z80 (new naming convention) identification
| |
1 |
2 |
3 |
4 |
5 |
|
| Z |
84C00 |
06 |
P |
S |
C |
|
| |
|
| 5. Environmental |
| A |
|
Hermetic stressed |
| B |
|
MIL STD 883 Class B |
| C |
|
Plastic standard |
| D |
|
Plastic stressed |
| E |
|
Hermetic standard |
| F |
|
Protopack standard |
| J |
|
JAN 38510 |
| |
| |
4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +100°C |
| M |
|
Military range -55 - +125°C |
| |
| |
|
3. Package type |
| D |
|
Ceramic DIP |
| F |
|
Plastic QFP |
| P |
|
Plastic DIP |
| V |
|
Plastic LCC |
| |
| |
|
|
2. Frequency |
| 04 |
|
4 MHz |
| 06 |
|
6.17 MHz |
| 08 |
|
8 MHz |
| 10 |
|
10 MHz |
| 20 |
|
20 MHz |
| |
| |
|
|
|
1. Part number |
| 08400 |
|
NMOS Z80 processor |
| 84C00 |
|
CMOS Z80 processor |
Z8 identification
| |
1 |
2 |
3 |
4 |
|
| Z |
8603 |
-12 |
P |
S |
|
| |
|
| 4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +85°C |
| M |
|
Military range -55 - +125°C |
| |
| |
3. Package type |
| C |
|
Ceramic side-brazed DIP |
| D |
|
Ceramic DIP |
| L |
|
Ceramic LCC |
| P |
|
Plastic DIP |
| R |
|
Protopack |
| T |
|
Low profile protopack |
| V |
|
Plastic LCC |
| |
| |
|
2. Frequency |
| No designation |
|
8 MHz for Z86xx, 4 MHz for Z80xx/Z85xx |
| -6 |
|
6 MHz |
| -12 |
|
12 MHz |
| |
| |
|
|
1. Part number |
| 8090 |
|
Universal peripheral controller with 2 KB ROM (Z-Bus) |
| 8094 |
|
Universal peripheral controller with PROM/RAM (Z-Bus) |
| 8590 |
|
Universal peripheral controller with 2 KB ROM (non-multiplexed bus) |
| 8594 |
|
Universal peripheral controller with PROM/RAM (non-multiplexed bus) |
| 8601 |
|
Z8 MCU with 2 KB ROM |
| 8603 |
|
Z8 prototyping MCU with external 2 KB EPROM |
| 8611 |
|
Z8 MCU with 4 KB ROM |
| 8612 |
|
Z8 MCU with 4 KB external ROM |
| 8613 |
|
Z8 prototyping MCU with external 4 KB EPROM |
| 8671 |
|
Z8 MCU with BASIC interpreter |
| 8681 |
|
ROMless version of Z8 MCU |
| 8682 |
|
ROMless version of Z8 MCU |
| 86L81 |
|
Low-power ROMless version of Z8 MCU |
| 86L85 |
|
Low-power ROMless version of Z8 MCU |
Z180 identification
| |
1 |
2 |
3 |
4 |
5 |
|
| Z |
80180 |
06 |
V |
S |
C |
|
| |
|
| 5. Environmental flow |
| C |
|
Plastic standard |
| |
| |
4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +100°C |
| |
| |
|
3. Package type |
| F |
|
Plastic QFP |
| P |
|
Plastic DIP |
| V |
|
Plastic LCC |
| |
| |
|
|
2. Frequency |
| 06 |
|
6 MHz |
| 08 |
|
8 MHz |
| 10 |
|
10 MHz |
| 12 |
|
12 MHz |
| 15 |
|
15 MHz |
| 20 |
|
20 MHz |
| 33 |
|
33 MHz |
| |
| |
|
|
|
1. Part number |
| 80180 |
|
80180 microcontroller |
| 8L180 |
|
Low voltage version of Z180 microcontroller |
Super-8 identification
| |
1 |
2 |
3 |
|
| Z |
8811 |
P |
S |
|
| |
|
| 3. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| E |
|
Extended range -40 - +85°C |
| M |
|
Military range -55 - +125°C |
| |
| |
2. Package type |
| C |
|
Ceramic DIP |
| L |
|
Ceramic LCC |
| P |
|
Plastic DIP |
| R |
|
Protopack |
| T |
|
Low profile protopack |
| V |
|
Plastic LCC |
| |
| |
|
1. Part number |
| 8801 |
|
ROMless version of Super-8 MCU |
| 8811 |
|
Super-8 MCU with 4 KB ROM |
| 8813 |
|
Super-8 prototyping MCU with external 4 KB EPROM |
| 8821 |
|
Super-8 MCU with 8 KB ROM |
| 8823 |
|
Super-8 prototyping MCU with external 8 KB EPROM |
| 8831 |
|
Super-8 MCU with 16 KB ROM |
| 8833 |
|
Super-8 prototyping MCU with external 16 KB EPROM |
V20 and V30 identification
| |
1 |
2 |
3 |
4 |
|
| Z |
70116 |
-5 |
D |
S |
|
| |
|
| 4. Temperature range |
| S |
|
Commercial range 0 - +70°C |
| |
| |
3. Package type |
| D |
|
Ceramic DIP |
| |
| |
|
2. Frequency |
| -5 |
|
5 MHz |
| -8 |
|
8 MHz |
| |
| |
|
|
1. Part number |
| 70108 |
|
V20 microprocessor |
| 70116 |
|
V30 microprocessor (V20 with 16 bit data bus) |