Details of embedded and OEM mobile Ivy Bridge CPUs

Last week VR-Zone leaked several slides with specifications of Intel Ivy Bridge mobile processors, and the slides revealed that Ivy Bridge lineup will include three quad-core chips, Core i7-3720QM, i7-3820QM and i7-3920XM. More recent VR-Zone story stated that there will be three additional quad-core models for OEM market: Core i7-3610QM, i7-3612QM and i7-3615QM. These processors will have 6 MB L3 cache, and they are going to be clocked lower, than i7-37xx and i7-38xx. VR-Zone article suggested that these three models will have 35 Watt Thermal Design Power.

We don't have any information on i7-361xQM mobile OEM parts. Coincidentally, we have information on three embedded Ivy Bridge CPUs, dubbed as Core i7-3610QE, i7-3612QE and i7-3615QE. While these embedded chips have longer life support, and may include additional reliability features, like support for ECC memory, their main characteristics look very similar to OEM mobile Core i7s.

According to our sources, Core i7-3610QE operates at 2.3 GHz, and can be clocked as high as 3.1 GHz when all cores are active, or up to 3.3 GHz with one active core. The CPU incorporates Hyper-Threading and Vpro technologies. It also integrates HD 4000 graphics with 650 MHz base frequency, and supports DDR3-1600 memory. Like i7-3720QM and i7-3820QM, this SKU has 45 Watt TDP. The chip will be produced in socket G2 compatible micro-PGA package.

Core i7-3615QE is very similar to i7-3610QE, except that it supports ECC memory, and is manufactured in BGA package. This SKU also has 45 Watt TDP.

Model i7-3612QE comes with lower 2.1 GHz clock speed, and, lower, up to 3.1 GHz, Turbo Boost frequency. This product will work with ECC memory, and it will be available in BGA package. This is the only embedded quad-core processor that will fit into 35 Watt thermal envelope.

As you can see from the specifications, features of embedded Ivy Bridge quad-cores match features of i7-3610QM, i7-3612QM and i7-3615QM microprocessors, that were disclosed by VR-Zone. We suspect that certain missing features of mobile processors in VR-Zone's article, like TDP and packaging, will also match.

Details of Core i7-36xxQM and i7-36xxQE microprocessors are summarized in the table below:

Model	Cores	Threads	Frequency	Turbo Frequency	L3 cache	Socket Type	TDP
Core i7-3610QE	4	8	2.3 GHz	3.3 GHz	6 MB	Socket G2	45 Watt
Core i7-3610QM	4	8	2.3 GHz	3.3 GHz	6 MB	Socket G2	45 Watt
Core i7-3612QE	4	8	2.1 GHz	3.1 GHz	6 MB	BGA1023	35 Watt
Core i7-3612QM	4	8	2.1 GHz	3.1 GHz	6 MB	BGA1023	35 Watt
Core i7-3615QE	4	8	2.3 GHz	3.3 GHz	6 MB	BGA1023	45 Watt
Core i7-3615QM	4	8	2.3 GHz	3.3 GHz	6 MB	BGA1023	45 Watt

Update (Dec 19): VR-Zone published detailed specifications of Core i7-361xQM mobile processors, including packaging data, TDP, Turbo Boost frequencies, integrated GPU frequencies, and support for various on-chip technologies and instruction sets. Their information confirms that only Core i7-3612QM will have 35 Watt TDP, and that i7-3610QM and i7-3615QM microprocessors will be produced in PGA and BGA packages respectively. Also, unlike embedded Core i7-361xQE parts, i7-361xQM CPUs are not going to support Vpro technology, and they will lack Trusted Execution and VT-d technologies.