AMD To Use IBM Foundries For Trinity Production

At last weeks Financial Analyst Day, AMD announced that they will be using IBM as a third foundry, alongside Global Foundries and TSMC, to produce the wafers for it's next generation Trinity APUs. Currently, 40 nm E-Series, W-Series and Z-Series APUs are manufactured at TSMC, and 32 nm Llano APUs are manufactured at Global Foundries. Trinity will be manufactured by both Global Foundries and IBM, using a 32 nm SOI process.

It seems that AMD are working to guarantee greater yields than Global Foundries were able to produce with Llano, which lost AMD some large contracts due to the low production. Previously, Global Foundries supplied IBM with the first SOI 32nm chips they produced, so it's not a surprise that AMD are now working with them.

If things go to plan, AMD might just regain some of the market share they lost with Llano, and regain some major contracts sugh as Apple and Lenovo.