Details of Intel Xeon Phi coprocessors
Intel started shipping samples of the B0 stepping of Xeon Phi co-processor cards, using the Knight's Corner-62 die, to some partners last week. Spawned from the ashes of the Larrabee graphics processor project, there are expected to be 5 different SKUs, with 57, 60 or 61 cores on a single die. The Xeon Phi coprocessors will run standard x86 code. Intel are hoping to break into the GPGPU computing world with Knight's Corner, offering a means for end users to increase their computing potential without having to rewrite code for heterogeneous computing. These Xeon Phi cards are already featured in the top 500 supercomputers list. The co-processors are expected to reach 1 TFLOPS DP (double precision) and 2 TFLOPS SP (single-precision) performance levels, no mean feat but one which will make the cards extremely versatile and ready for HPC implementations.
The cards will have from 1.8 MB to 1.9 MB of L1 cache, and from 28 MB to 30.5 MB of L2 cache. Different SKUs will have 3GB, 6GB or 8GB onboard GDDR5 memory. The 57-core board will have a minimum clock speed of 600 MHz, and come with 3 GB or 6 GB memory. 60- and 61-core cards will be clocked at 630+ MHz, and have 8GB of memory. The 57 core Xeon Phi models will have a maximum clock of 1.1 GHz, with the other SKUs running at between 1.05 and 1.09 GHz. There will be a turbo clock feature, but details of that are not yet known. The memory will be clocked at 1.25 GHz - 1.375 GHz (5 GHz - 5.5 GHz effective), giving in excess of 300 GBb/s bandwidth.
The 57C/3GB and 61C/6GB models will have a TDP of 245W, while the 57C/6GB and both the 61C/8GBb models will have a TDP of 300W. There will be two cooling options, either passive or with a fan. The passive models are designed for systems which have a large amount of air flowing through them, such as some rackmount systems. The active cooling is only available on the 57C/6GB/300W, and some Xeon Phi SKUs will come with no cooling solution, making them ideal candidates for water cooling and other third party cooling solutions.
Related News (older articles):
Jun 19, 2012: Intel announces Xeon Phi coprocessor brand