Package options of desktop and mobile Haswell processors
In July, when we posted the launch schedule of Haswell microprocessors, we mentioned that they will come with three different tiers of on-chip graphics: GT1, GT2 and GT3, with the GT3 having the best performance from all three. As you may guess, Intel is not going to make one die design with GT3 GPU, and then disable some execution units to turn it into GT2 or GT1. Like with Ivy Bridge CPUs, that had separate GT1 and GT2 configurations, there will be two die variations for Haswell, one with GT3 graphics and one with GT2. Additionally, dual- and quad-core processors will utilize different dies. Finally, some Haswell chips will integrate dual-channel memory controller, while others will have only single-channel one. In total, that gives 8 die configurations (better called package configurations or package options, because All-In-One ultra-low voltage processors will have 2 dies on a chip). Obviously, some configurations, such as a quad-core CPU with single-channel memory controller, don't make much sense, therefore we will see only several package options, which are described further below. To specify, which integrated components are provided in the processor package, Intel uses "A + B + C" format, where A stands for the number of CPU cores, B is the graphics tier level, and C is the number of memory channels.
Haswell desktop CPUs will use 4+2+2 and 2+2+2 package options. That is, there won't be GT3 on the desktop. All desktop products will be manufactured in an LGA package, and support DDR3 memory up to DDR3-1600. The memory controller on desktop parts will work with one or 2 DIMMs per channel, which translates to the maximum supported memory size 32 GB.
Haswell mobile CPUs will utilize 4+3+2, 4+2+2 and 2+2+2 options. The processors with GT3 GPUs will only be manufactured in a BGA package, which means that it won't be possible to upgrade CPUs in notebooks with GT3 graphics, and it won't be possible to upgrade notebooks with GT1/GT2 graphics to GT3 level. Processors with GT2 GPUs will be made both in BGA and PGA packages. All mobile SKUs will support 1 DDR3/DDR3L DIMM per memory channel, with data rates up to 1600 MHz. Quad-core mobile chips will also support 2 DDR3-1333 DIMMs per channel. The maximum memory size with 1 DIMM and 2 DIMMs per channel will be 16 GB and 32 GB respectively.
Ultra Light and Thin (ULT) CPUs, that integrate Lynx Point chipset on the package, will use 2+3+2 and 2+2+1 package types. Combined TDP of integrated CPU cores, GPU and the chipset on these parts is only 15 Watt, therefore it is logical that the number of cores was limited to two. ULT microprocessors will be produced in a BGA package, and work with DDR3L/low power DDR3 memory with data rates up to 1600 MHz. Memory controller will support only one DIMM per memory channel, for that reason less expensive ULT products with single memory channel will be limited to 8 GB of RAM.
We haven't seen any references to package options with GT1 graphics. We suspect that GT1 chips will be essentially GT2 parts with a number of execution units disabled.
The summary of Haswell package options is provided below:
Related News (newer articles):
Dec 16, 2012: Specifications of mobile Haswell CPUs
Dec 13, 2012: Details of Haswell desktop CPU lineup
Aug 31, 2012: Basic features of Haswell Core, Pentium and Celeron CPUs
Aug 23, 2012: New video and graphics features of Haswell CPUs
Related News (older articles):
Jul 10, 2012: Launch schedule of Intel Haswell processors
Nov 11, 2011: Details of Intel Haswell microarchitecture leaked