Basic features of Haswell Core, Pentium and Celeron CPUs
Earlier this week computerbase.de posted slides of a leaked Intel document, containing roadmap for embedded microprocessors up to Q2 2013. According to the roadmap, there won't be new Sandy Bridge and Ivy Bridge embedded processors before the launch of Haswell CPUs in Q2 2013. Sadly, the document doesn't contain any information on Haswell specific SKUs, but there are details on package options, chipset and CPU features, and support of these features on different Haswell processor families. Some information was already published before. The most interesting part from the document is a slide with features of desktop Haswell CPU families. Similar slide for mobile Haswell microprocessors is incomplete, because it doesn't show any PGA chips, nor does it show quad-core SKUs with GT3 graphics. Both slides are for embedded lineup of Intel processors, but we suspect that the most basic characteristics, such as the number of cores, power requirements, and technologies, will be identical between desktop and embedded products. Furthermore, we found additional information on Haswell families, including supported technologies and the size of L3 cache, from another source.
The "Celeron" brand, which was utilized for entry-level Sandy Bridge microprocessors, will also be used for Haswell CPUs. The Celerons will have two cores, 2MB L3 cache, and execute two threads at most. The processors will include GT1 graphics, along with dual-channel memory controller, which will support DDR3L-1333 memory. Mainstream Celeron SKUs will be rated at 60 Watt TDP, and low-power Celeron chips will have 35 Watt TDP.
Haswell Pentium CPUs will have the size of L3 cache increased to 3 MB, and up to 4 MB on some SKUs. The DDR3 memory controller will add support for 1600 MHz data rate. Like Celerons, the Pentiums will use only GT1 graphics, and they will come with 35 Watt and 60 Watt TDP.
Similar to budget Celeron and Pentium families, Core i3 parts are going to have 2 CPU cores. However, the i3s will also have Hyper-Threading technology enabled, that will allow each core to execute two threads at once. New features on the CPU side of i3 chips will be AVX instructions. Integrated GPU will be GT1, or faster GT2 graphics on some SKUs, and it will support such video processing technologies as Quick Sync Video and Clear Video HD. Thermal Design Power of Core i3s will be 35 and 60 Watt.
Core i5 microprocessors will double the number of cores to 4, and increase the size of L3 cache to 6 MB. Hyper-Threading feature on i5s will be disabled, as such the CPUs will be limited to 4 simultaneous threads. Core i5 processors will add support for AES instructions, and Turbo Boost technology, which may temporarily "overclock" the cores to achieve greater performance. There will be 35W, 65W and 95W versions of Core i5 microprocessors.
Historically, Intel Core i7-branded parts had most of the features enabled. This won't change with the Haswell architecture. The i7 CPUs will have the size of L3 cache increased to 8 MB. The Hyper-Threading technology will be enabled on i7s. The processors will be shipped only with GT2 graphics, and with three different TDP ratings: 45W, 65W and 95 Watt.
Please see below for a summary of features of Haswell CPU families:
Related News (newer articles):
Dec 16, 2012: Specifications of mobile Haswell CPUs
Dec 13, 2012: Details of Haswell desktop CPU lineup
Related News (older articles):
Aug 23, 2012: New video and graphics features of Haswell CPUs
Aug 21, 2012: Package options of desktop and mobile Haswell processors
Jul 10, 2012: Launch schedule of Intel Haswell processors
Nov 11, 2011: Details of Intel Haswell microarchitecture leaked