AMD X4 4410 and X2 3450 "Kabini" APUs to launch in June 2013
In January we reported on three AMD "Kabini" APUs that are expected to be released in the second quarter 2013. Major new feature in these processors are up to 4 CPU cores, that employ improved "Jaguar" core, and HD 8000 series graphics, compatible with DirectX 11.1. The APUs will be offered with Thermal Design Power ranging from 15 Watt to 25 Watt. So far we published partial specification of three SKUs, X4 5110, E1 3310 and E1 2210. Fudzilla this week revealed that there will be two additional models, X4 4410 and X2 3450.
Like X4 5110, the X4 4410 will have 4 CPU cores, and the same HD 8310G integrated graphics. The processor will fit into 15 Watt thermal envelope. Clock speed of the X4 4410 is not known at this time.
AMD X2 3450 will come with HD 8280G GPU, and 15 Watt TDP. Based on the "X2" series name, this APU will have 2 CPU cores. Operating frequency of this model is also not known.
Both X4 4410 and X2 3450 will feature Turbo Core technology and support for DDR3-1866 memory. The processors will be produced in a BGA package. AMD X4 4410 and X2 3450, as well as X4 5510, E1 3310 and E1 2210 are expected to launch in June, possibly at Computex Show in Taiwan.
Known details of Kabini processors are provided below:
| Model | Cores | Graphics | TDP |
|---|---|---|---|
| E1 2210 | 2? | No data | No data |
| E1 3310 | 2? | HD 8240G | 15 Watt |
| X2 3450 | 2? | HD 8280G | 15 Watt |
| X4 4410 | 4 | HD 8310G | 15 Watt |
| X4 5110 | 4 | HD 8310G | 25 Watt |
Jan 03, 2013: Kabini to replace Bobcat APUs in June 2013
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What sockets, just BGA ??
Yes, I know the article says: "processors will be produced in a BGA package", but is that for the last 2 mentioned, or all of them?? BGA is an embedded part, we need some of these low watt CPU's in normal sockets for enthusiasts: FM2 for Graphics incorporated, AM3+ for others.
These are not the enthusiast line
These Kabinis are not AMD's enthusiast line of APUs, they are mobile SOCs. You are likely to get these on mini-ITX boards already soldered on with a passive heatsink. If you want a socketed APU, it is the Richland now or Kaveri at the end of the year.
What we really need is bigger cpus. Make the dies 3 inches wide and 5 inches tall, then we have a big performance boost.
Uhhh..because of heat/power requirements!? Also 3d stacking of cpus, are not silicon based, so until Intel see it fit to go beyond the ultra violet lithography (1-10nm). It just doesn't make business sence.. :(
df
Don't give me your excuses, the good performance boosts come with visible changes, not just on paper, but actual ones you can touch. I bet if AMD made a big CPU die people would buy them regardless of the power consumption.
youre kidding right
That is nonsense
dff
Don't give me your excuses, the good performance boosts come with visible changes, not just on paper, but actual ones you can touch. I bet if AMD made a big CPU die people would buy them regardless of the power consumption.
Bigger cpu dies mean production costs go up not just because you can fit fewer cpus on each wafer but also because the larger the cpu the greater a chance that part of it will be in a bad part of the wafer and the greater the chances each cpu will be defective.