At International Supercomputing Conference at Leipzig, Germany, Intel officially introduced Xeon Phi 3100 and 7100 series co-processors, and revealed details of future "Knights Landing" products. Intel Xeon Phi family was announced last November, and so far Intel released three different models from 5100 series, with only 5110P SKU available in retail. New Xeon Phi products, launched this week, include 7120P and 7120X high-performance parts, 5120D for dense servers, along with 3120A and 3120P "value" co-processors.
Xeon Phi 7120P and 7120X are implemented as PCI-Express cards, housing the co-processor chip and on-board GDDR5 memory. The 7120P also includes a passive thermal solution (heatsink). Both parts have 61 cores, operating at 1.238 GHz. Xeon Phi 7100 series co-processors support Turbo Boost feature, that can increase frequency up to 1.33 GHz when needed. The cards have on-chip 30.5 MB L2 cache, and there is also 16 GB of GDDR5 memory soldered on the board. The peak performance of these co-processors exceeds 1.2 TFLOPS. The 7120P and 7120X are rated at 300 Watt TDP, and priced at $4129.
Xeon Phi 3120A and 3120P are positioned as inexpensive co-processors. They incorporate only 6 GB of on-board memory, therefore they are better suited for CPU bound tasks. The 3120A and 3120P have 57 cores and 28.5 MB L2 cache. The co-processors operate at 1.1 GHz, which results in peak performance of 1003 GFLOPS. Thermal Design Power of 3100 series cards is 300 Watt. The 3120A has an active cooling solution, while the 3120P has a passive one, and that is the only difference between them. The official price of these parts is $1695.
Xeon Phi 5120D is produced in a different form factor than 3100 and 7100 series cards. This part is shipped as a PCB with installed co-processor and 8 GB of on-board GDDR5 memory. The PCB has a 230-pin edge connector, that fits into x24 PCI Express slot. The 5120D has 60 cores, and 30 MB of L2 cache. The part runs at 1.053 GHz, does not support Turbo Boost technology, and does not come with a thermal solution. The TDP of this co-processor is 245 Watt, and the peak performance is 1011 GFLOPS:
|Xeon Phi 3120A||57||228||1.1 GHz||28.5 MB||6 GB||300W||$1695|
|Xeon Phi 3120P||57||228||1.1 GHz||28.5 MB||6 GB||300W||$1695|
|Xeon Phi 5120D||60||240||1.05 GHz||30 MB||8 GB||245W||$2759|
|Xeon Phi 7120P||61||244||1.23 / 1.33 GHz||30.5 MB||16 GB||300W||$4129|
|Xeon Phi 7120X||61||244||1.23 / 1.33 GHz||30.5 MB||16 GB||300W||$4129|
Additionally, Intel disclosed some details on "Knights Landing" architecture, that will be used for the next generation of Xeon Phi offerings. "Knights Landing" products will be fabricated on 14mn process, and will be shipped as co-processors, as well as processors. Future co-processors will be similar to "Knights Corner" parts, that is they will be available as PCI-E cards. On the contrary, "Knights Landing" processors will fit into a motherboard socket, and will work as a standalone CPU and a co-processor at the same time. The processors will also have additional on-package memory, that will considerably increase their memory bandwidth.
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