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Some details of mobile Broadwell CPUs

Last month we reported on preliminary lineup of Broadwell mobile microprocessors. In that report we mentioned several variations of Broadwell chips, such as "Y", "U" and "H" versions, having different power requirements. The "H" and "U" chips will be available with more than one type of GPU. Furthermore, there will be 1- and 2-chip versions. All "Y" and "U", and a handful of "H" parts will be produced as systems on a chip (SoC), that will integrate the CPU and GPU units, as well as the PCH-LP chipset. Later in the article we will refer to them as SoCs, 1-chip or single-chip processors. Some "H"-class CPUs will require an external 8- or 9-series chipset, and those are referred to as 2-chip processors. This distinction is important because certain Broadwell features will be offered only on specific variations.

Broadwell products will be built on 14 nm manufacturing process, and will incorporate well known technologies, like Hyper-Threading and Turbo Boost 2.0, along with AES, AVX2 and TSX extensions to the x86 instruction set. The "H" microprocessors will have 4 CPU cores and up to 6 MB of last level cache, and a number of "H" SKUs with GT3e graphics will also have an extra cache memory (eDRAM), implemented as a separate die on a chip. The "U"/"Y" SoCs will have 2 cores and up to 4 MB of L3 cache. The last level cache in all chips will be shared between the CPU cores and the graphics unit.

The Broadwell GPU will be based on 8th generation graphics architecture, and will have 20% more execution units than Haswell counterparts with the same GPU type. That means that Broadwell GT3 units will have 48 EUs. The graphics unit will support DirectX 11.1, OpenGL 4.2 and Open CL 1.2/2.0 APIs.

Broadwell will support older video processing features, such as Quick Sync and Clear Video technology. The processors will also add such new features, like SVC hardware accelerated decoder, and VP8 hardware decoder.

Similar to Haswell, Broadwell products will embed a Fully Integrated Voltage Regulator on a chip. The "U" and "H" parts will come with CPU, memory and GPU overclocking, that will be supported by Extreme Tuning Utility. Unfortunately, we do not have information on this feature and the extent of allowed overclocking.

The "H" microprocessors will support DDR3L and DDR3L-RS memory with data rates up to 1600 MHz. The "Y" chips are going to work with LPDDR3-1600 memory. The "U" SoCs will work with both the DDR3L/DDR3L-RS, and LPDDR3 memory. Some older Broadwell slides and specs stated that "Y" SoCs will support DDR4 memory, however this memory type is no longer referenced in more recent documents.

New security technologies in Broadwell are Boot Guard, PTT 2.0, Enhanced Malware protection, Data Protection technology with new RDSEED instruction, just to name a few. The processors will also support AMT 10.0, Small Business Advantage 3.0, and Intel WiDi Pro. There will be also some crypto performance enhancements.

Single-chip processors will have a Smart Sound technology, that will provide audio processing acceleration, and will offer such capabilities as "wake on voice" and "personal speaker identification". To be more precise, the Smart Sound technology will be a part of integrated PCH-LP chipset. It will not be supported by the HM97 chipset, therefore it will not be available on 2-chip "H" microprocessors.

Broadwell parts with integrated PCH-LP chipset will be limited to PCI-Express 2.0, and 2-chip "H" versions will have 16 lanes of PCIe 3.0.

Power saving technologies on Broadwell parts will include on-die Power Control unit, Power Aware Interrupt Routine, Display Power Saving Technology, and support for low-power states up to C10 on single-chip processors, and up to C7 on 2-chip "H" CPUs.

Thermal Design Power of Broadwell microprocessors will range from 4.5 Watt to 47 Watt. The "H" CPUs will have 47 Watt TDP, with some SKUs supporting 37 Watt configurable TDP. The "U" parts will have 15 Watt and 28 Watt TDP, and some SKUs will have lower 8.5 Watt and 23 Watt configurable TDP. The TDP of "Y" SoCs will be just 4.5 Watt. They will also support configurable TDP, that will go as low as 3.5 Watt, and will have scenario design power of 2.8 Watt.

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There are 8 comments posted

Y Series

2013-12-20 18:56:43
Posted by: JD

A 4.5 TDP is a massive improvement over the 11.5 TDP from Haswell-Y. If performance is the same then we may have a winner on our hands. Though personally I want at a U-series at 15w. I hope eventually they can make their quad cores come down to that power level.


2013-12-20 23:36:31
Posted by: gmb

Do you know EU number for GT2 and GT1? 20% more as well? Would mean GT1 gets 12 EU and GT2 24EU.


2013-12-21 18:39:42
Posted by: gshv

The documentation said that Broadwell GT2 and GT3 will have 20% more executions units than Haswell. I confirmed 48 EUs from another source. I couldn't confirm 24 EUs for GT2, therefore it was not mentioned in the story.


2013-12-21 20:38:49
Posted by: gmb

20% for GT2 is more or less a confirmation for 24EUs, it also coincides with Intels GenX diagram from HPG2012.

What is SVC

2013-12-22 01:28:02
Posted by: rd

What is SVC mention in the article
in regard to SVC hardware accelerated decoder.

H265 is HEVC.
Shouldn't broadwell support H265.


2013-12-22 02:03:56
Posted by: gshv

SVC = Scalable Video Codec. Haswell supported encoding and decoding, and Broadwell adds hardware acceleration for decoding.


2013-12-22 13:36:00
Posted by: iMacmatician

Do you know if there will there be a GT4 Broadwell?


2013-12-23 06:39:45
Posted by: Broadwell-Fan

I hope a GT4 version is coming with Broadwell

I personally just have a bad feeling that GT4 will only come with Skylake in 2015. Only with a combination of DDR4 2400 the performance can be improved since GT3 ULT (15/28Watt) is somewhat bandwidth limited.

@CPU-World: Any information when or if GT4 arrives?

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