SLAP9 (Intel Core 2 Duo Mobile T8100)

Specifications

General information
Type	CPU / Microprocessor
Family	Intel Core 2 Duo Mobile
Processor number ?	T8100
Part number	FF80577GG0453M BX80577T8100
Frequency (GHz)	2.1
Frequency in IDA mode (GHz)	2.3
Frequency in LFM mode (GHz)	1.2
Frequency in SLFM mode (GHz)	0.8
Bus speed (MHz) ?	800
Clock multiplier ?	10.5
Package type	478-pin micro-FCPGA
Socket type	Socket P

Architecture / Microarchitecture / Other
CPUID	010676h
Core stepping	M0
Processor core	Penryn-3M
Manufacturing technology (micron)	0.045
Number of cores	2
L2 cache size (MB) ?	3
Features	EM64T technology ? Enhanced SpeedStep technology ? Execute disable bit ? Intel Dynamic Acceleration Virtualization technology
Core voltage (V) ?	1 - 1.25
Core voltage in IDA mode (V)	1 - 1.3
Core voltage in LFM mode (V)	0.85 - 1.25
Core voltage in SLFM mode (V)	0.75 - 0.925
Case temperature (°C) ?	100
Thermal Design Power (Watt) ?	35

Notes on sSpec SLAP9
The part is discontinued. Last order date for OEM and boxed processors is July 24, 2009. Last shipment date for boxed processors is October 23, 2009. Last shipment date for OEM processors is September 24, 2010.

Last modified: 11 Sep 2011