Chip Packages

[Neon_WA]

List so far of chip packages. there is certainly more to add

DIP ___ Dual In-line Package ___ Terminals are on two opposite sides of the package and are arranged two rows. Lead pitch = 2.54 mm
FBGA ___ Fine Pitch Grid Array ___ Balls are on one surface of the package and are arranged in a grid array. Terminal pitch=0.8mm or less.
LGA ___ Land Grid Array ___ Lands are on one surface of the package and are arranged in a grid array.
PGA ___ Pin Grid Array ___ Terminals are on one surface of the of the package and are arranged in a grid array. Lead pitch = 2.54mm, 1.27mm
QFN ___ Quad Flat Non-leaded Package ___ Terminals are on four sides of package and exist on the side or bottom of package.
QFP ___ Quad Flat Pack ___ Terminals are on four sides of the package and are formed gull-wing shape(L-shape). Lead pitch = 1.0 mm,0.8 mm,0.65 mm
QFP (FP) ___ Quad Flat Pack (Fine Pitch) ___ Terminals are on four sides of the package and are formed in a gull-wing shape (L-shape). Lead pitch = 0.5 mm,0.4 mm
SDIP ___ Srink Dual In-line Package ___ Terminals are on two opposite sides of the package and are arranged two rows. Lead pitch = 1.778mm
SIP ___ Single In-line Package ___ Terminals are on two opposite sides of the package and are arranged two rows. Lead pitch = 1.778mm
SOJ ___ Small Outline J-leaded Package ___ Terminals are on two opposite sides of the package and are formed in J-shape. Lead pitch = 1.27 mm
SOP ___ Small Outline Package ___ Terminals are on two opposite sides of the package and are formed in a gull-wing shape (L-shape). Lead pitch = 1.27 mm
SSOP ___ Srink Small Outline Package ___ Terminals are on two opposite sides of the package and are formed in a gull-wing shape (L-shape). Lead pitch = 0.8mm. 0.65mm. 0.5mm
TSOP (I) ___ Thin Small Outline Package ___ Terminals are on two opposite sides of the package's shortest side and are formed in a gull-wing shape (L-shape). Package and seating height are 1.0 mm (nominal) and 1.27 mm (Max). Lead pitch = 0.5mm
TSOP (II) ___ Thin Small Outline Package ___ Terminals are on two opposite sides of the package's longest side and are formed in a gull-wing shape (L-shape). Package and seating height are 1.0 mm (nominal) and 1.27 mm (Max). Lead pitch = 1.27 mm.0.8 mm
V-DIP ___ Vertical Dual In-line Package ___ Terminals are on one side of the package and bent for through hole mounting.
ZIP ___ Zig-zag In-line Package ___ Terminals are on one side of the package and bent alternately within the package thickness. Lead pitch = 1.27mm, 0.889mm

[Neon]

LCC Leadless Chip Carrier

[johnorun]

BGA=Ball Grid Array
PDIP= Plastic Dual In-line Package
CDIP= Ceramic Dual In-line Package

Are you sleeping, eating with all these projects?
Thanks for all this effort, Neon!

[Neon_WA]

[CPUShack]

dont forget QUIP QUad Inline Package (NEC uses them alot)