HD anti-static foam

[Neon_WA]

I have quite a few chips posted to me (for forum & ebay) in the last month using a variety of packaging methods.

One thing i have noticied, is of the PGA chips & DIPs with bent pins i have received, most (90%) have been packaged in high density foam for shipment.

it seems to me that the foam is too dense and if the pins are not pefectly straight to start off with, it only makes them worse.

The pins being splayed out isnt too bad, but some pins dont even go into the foam but end up being bent at right angles, leaving a crease in the pin even after straighten.

The worst case i have had is a ceramic dip that looked ok from top, but most likely pressure was not applied over the whole dip as it was placed into the foam, as it has a crack in the ceramic on the bottom. The only thing holding it together is the gold die cap on the top.

My question is... Should HD foam used as a everyday packing medium for chip & dips with soft pins?

What is other peoples experiences?


edit>> there seems to be different types of high density foam.. the worst offender appears more shiny and open pored, also more pressure is needed to place the chips into the foam compared to other HD foams:?

[CPUShack]

there is HDPE, and urethane foams, if attention is paid while inserting, both seem to work well.