IBM SLT Chips - various

[nivrnb]

Hope you enjoy.

Robert

[bccwchan]

[nivrnb]

Billy,

Thanks, they have a very neat looking design. I am trying to get the green coat off of the these chips, for a project. I have many of this chips, I don't know if there is a market for them.

Robert

[UMMR]

Hi,
nice and interesting pictures.
As You can see the chips are mounted face down ("flipchipped"): the mounting/soldering process was the long lived C4 (Controlled Collapse Chip Connection), patended by IBM in 1963. "Big Blue" and DEC pioneered this important assembly method (hence the name FlipChip given to many DEC modules and chips). It is base upon the collapse of micron-size alloy "balls" heated and then treated with appropriate frequency ultrasounds. These "balls" are placed just over the connection placeholders in the upper metallization layer of the chip to be mounted. This process proved successful and very reliable and was used by IBM and other manufacturer for decades.
With the help of a little gas torch you can try to de-mount the chips (you have to remove in advance the transparent silicon protective layer).
Many of these chips are MSI and LSI TTL gate arrays.
Paolo

[mavroxur]

I have a ton of boards with these IBM tin cans on them. I pulled them from ancient IBM terminals. I can't remember the model number, but they were twinax connected, monochrome, with linear power supplies. Really old school.