aberco
Joined: 05 Sep 2013
Posts: 2655
Location: Paris France
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 Posted: Tue Sep 24, 2013 3:59 pm Post subject: Stabilizing the pins on those fragile QFP packages |
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An experiment I tried a while ago after desoldering a PowerPC 601 that had seen better days. It obviously had burnt on the motherboard, and the ceramic substrate was split in two places, the chip only held together by the blue polyurethane encapsulant. I used epoxy glue to fix the cracks, and also dispensed some on the pins.
The pins are now impossible to bend, the chip can even survive 1m drops on the floor without any damage. I guess the glue can be dispensed much more elegantly using a syringe, but it work. Only downside is that it's permanent.
Yeah, you can wear it too...
Last edited by aberco on Tue Sep 24, 2013 4:16 pm; edited 1 time in total |
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