NEXGEN TECHNICAL DOCUMENTS & MORE NOW ON eBAY

[cpudesigner]

eBay item 8724249648 from my personal memorabilia.

1. Multi-layer plot at 25X of development test chip for Address Processor (AP). AP was originally one of planned chip set and later became key part of integrated 586. AP generated all addresses to memory, coordinated protected mode execution, and responded to interrupts. It may have been the most complex logic block in the 586. Plot measures approximately 18 inches by 20 inches with plot of die occupying approximately 14 inches by 14 inches. Around periphery of die-plot is handwritten annotation identifying different logic sections of this early test die. SPECIAL: Manager of AP design will autograph plot upon request.

2. Microprocessor Report reprint vol. 8 no. 4, "NexGen Enters Market with 66-MHz Nx586." In depth 6 page analysis of 586 chip with block diagrams, pipeline example, and photocopy of die.

3. "NexGen Compatibility Report " (preliminary) detailing results of testing by XXCAL, Inc. Testing Laboratories. 24 pp

4."NexGen VAR Guide to Fully-Optimized Price/Performance PCs, VLB Edition" is a 24 pp guide for customers of NexGen (primarily Value Added Retailers) on how to achieve optimal price/performance configurations.

5. Photos (8) of NexGen at COMDEX in 1996 including one of illuminated plot of 586 die at the display booth.

6. SURPRISE! Souvenirs for the NexGen fan. Please don't ask what they are.