The new Hysol FP4547FC chip

[jd]

Here's an interesting chip that recently came out on the market...

The Hysol FP4547FC .

Description:

Henkel Corporation has introduced Hysol FP4547FC, the first capillary flip-chip underfill designed to be compatible with clean and no-clean flux residues. This unique product protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260°C moisture test requirements.


Hysol FP4547FC provides superior moisture resistance and reduces stress, thereby delivering higher reliability than competitive underfills. By incorporating two patented additives that remove and neutralize flux residues from between the flip-chip die and substrate, Hysol FP4547FC delivers excellent results on high performance assemblies. This underfill meets the new JEDEC requirements for lead-free flip-chip assembly, while providing excellent thermal cycle performance and simplifying the assembly process. In most cases, post-assembly flip-chip cleaning processes may be eliminated, saving manufacturing time and capital resources


Cool eh!


Glin

[sammyc]

Well it certainly looks cool (has the look of a uncapped Xeon to me) But that text above means totally squiddily dot to me...