| View previous topic :: View next topic |
| Author |
Message |
Vlasta

Joined: 15 May 2012 Posts: 2565
|
Posted: Mon Jun 11, 2012 11:01 am Post subject: Nice Clean 8"/200mm Intel Wafer FOR SALE |
|
|
Hi - offers please in open forum. $10 registered airmail shipping.
[/b] _________________ best rgds.
Steve
Last edited by Vlasta on Sat Jul 21, 2012 5:38 pm; edited 3 times in total |
|
| Back to top |
|
 |
kosmokrator

Joined: 03 Jul 2008 Posts: 4085 Location: Athens-GR
|
Posted: Mon Jun 11, 2012 11:11 am Post subject: |
|
|
| What is this? Pg Arrays??? Veryy High Dense looking |
|
| Back to top |
|
 |
Vlasta

Joined: 15 May 2012 Posts: 2565
|
Posted: Mon Jun 11, 2012 11:12 am Post subject: |
|
|
I don't have a microscope so cannot tell - I can try and take a macro tomorrow and post it. _________________ best rgds.
Steve |
|
| Back to top |
|
 |
Vlasta

Joined: 15 May 2012 Posts: 2565
|
Posted: Mon Jun 11, 2012 9:46 pm Post subject: |
|
|
OK Guys - some close up shots - as close as I can get them anyway.
I got a nice email from someone telling me what these might be and if some clever dude (cleverer than me anyway) could remove the copper layer then we might see something truly beautiful underneath.
From my correspondent:-
"looks like real chips, since (I think) there are bond pads on the edges.
I think these copper-based chips typically have their real circuitry
buried under a layer of insulating material, upon which one or more
layers of copper are created. In some cases, these top layers are for
hundreds or thousands of solder balls, by which the chip is connected to
its package. In other cases, with conventional bond-pads, I think the
top layers are for interconnect and power supply distribution.
With these copper-based silicon wafers, I find it is usually possible to
get a glimpse of the real circuitry, right at the edge of the wafer,
where the polishing system has not allowed the upper layers of copper
and their insulating layer to remain. If you see pretty colours a few
mm from the edge, that is the diffraction patterns of the very fine
tracks used in the actual circuitry, with transistors etc. So what you
see in most of this chip is just the top layers which may have little to
do with the real circuitry.
This looks like a very big chip to have so few connections that bond
pads will be sufficient. Alternatively, it will have solder balls,
perhaps thousands of them, but these may not yet have been added."
Pictures:-
 _________________ best rgds.
Steve |
|
| Back to top |
|
 |
Vlasta

Joined: 15 May 2012 Posts: 2565
|
|
| Back to top |
|
 |
|