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aberco

Joined: 05 Sep 2013 Posts: 2655 Location: Paris France
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Posted: Sat Dec 28, 2013 12:05 pm Post subject: Inside the Power3 |
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| Here's the original IBM Power3 die exposed (270 mm2) |
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CPUShack

Joined: 16 Jun 2003 Posts: 34259 Location: State of Jefferson, USA
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aberco

Joined: 05 Sep 2013 Posts: 2655 Location: Paris France
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Posted: Sat Dec 28, 2013 1:53 pm Post subject: |
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Well I have compiled data for POWER, and the Itanium Merced that I opened recently is significantly larger than anything IBM made (except the Power7... but that should be a composite die on a silicon interposer).
When combining all dies it is also larger than POWER1 and POWER2 MCM.
CPU 21*22=462
L3C 18*13=234
Total=1398 mm2 (4MB cache)
That Itanium Merced must have costed a fortune to make! |
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CPUShack

Joined: 16 Jun 2003 Posts: 34259 Location: State of Jefferson, USA
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frag_
Joined: 17 Nov 2008 Posts: 4015 Location: Estonia
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Posted: Sat Dec 28, 2013 2:42 pm Post subject: |
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Still much smaller than some ccd sensors
Some of them are > 2000 mm^2. |
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CPUShack

Joined: 16 Jun 2003 Posts: 34259 Location: State of Jefferson, USA
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henriok

Joined: 30 Dec 2007 Posts: 157 Location: Gothenburg, Sweden
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Posted: Sun Dec 29, 2013 8:49 am Post subject: |
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This is very cool! Very nice, and quite a unique picture too. I certainly haven't seen a unlidded POWER3 before, only POWER3-IIs and they come on IBM's famous white substrate.
May I enquire what the customs of this board are? Can I come with a request of photos of the tiny text on the die and the corner where the pin #1 is located (upper right in this picture). Or would that be rude? _________________ Always on the look out for POWER, PowerPC and Power Architecture information. For photographs, information and parts to buy. Am doing research at Wikipedia |
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