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CPUShack
Joined: 16 Jun 2003
Posts: 34259
Location: State of Jefferson, USA
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aberco
Joined: 05 Sep 2013
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Location: Paris France
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 Posted: Fri May 02, 2014 6:51 pm Post subject: |
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There's only one die that got ripped in the polysilicon layer, leaving only the metalization attached to the ceramic substrate and the silicon on the heatspreader.
This happened because the die is actually soldered on the heatspreader.
I have that on a Fujitsu Sparc64, and it's also quite common on Xeons and P4s.
I guess that if you heat it the C4 balls will disolder from the substrate, but if you try to remove it mechanically the die will get ripped off.
Last edited by aberco on Fri May 02, 2014 6:55 pm; edited 1 time in total |
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CPUShack
Joined: 16 Jun 2003
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Location: State of Jefferson, USA
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Vlasta
Joined: 15 May 2012
Posts: 2565
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| Posted: Sun May 04, 2014 7:36 pm Post subject: |
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Kind of perversely it looks prettier than finding a polished die!!!
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best rgds.
Steve |
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