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tlccomp
Joined: 11 May 2006
Posts: 1212
Location: Southeast Wisconsin, USA
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 Posted: Fri Aug 11, 2006 5:27 pm Post subject: Eprom, No markings? |
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Just got this in. No markings on the bottom but writing on the top.
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jd
Joined: 01 Jan 2006
Posts: 1562
Location: Canada
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| Posted: Fri Aug 11, 2006 5:36 pm Post subject: Re: Eprom, No markings? |
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| tlccomp wrote: | Just got this in. No markings on the bottom but writing on the top.
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ooooooooooH very nice ! |
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chip68
Joined: 19 Oct 2004
Posts: 1024
Location: Central Pennsylvania
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| Posted: Sat Aug 12, 2006 12:57 am Post subject: |
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The die doesn't look anything like an EPROM die... And the package also reminds me an awful lot of the kind I used to get when I had chips made through the MOSIS prototyping service:
http://www.mosis.org/Technical/Packaging/Ceramic/pkg-dip28-char.pdf
They sent them out with the lids just taped on. Is there in fact a quartz lid, or no lid at all?
- CMW |
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tlccomp
Joined: 11 May 2006
Posts: 1212
Location: Southeast Wisconsin, USA
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| Posted: Sat Aug 12, 2006 6:23 am Post subject: |
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| chip68 wrote: | The die doesn't look anything like an EPROM die... And the package also reminds me an awful lot of the kind I used to get when I had chips made through the MOSIS prototyping service:
http://www.mosis.org/Technical/Packaging/Ceramic/pkg-dip28-char.pdf
They sent them out with the lids just taped on. Is there in fact a quartz lid, or no lid at all?
- CMW |
No lid. In fact 2 other chips I got from the same source are the same way, no lids.
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chip68
Joined: 19 Oct 2004
Posts: 1024
Location: Central Pennsylvania
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| Posted: Sat Aug 12, 2006 11:15 am Post subject: |
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The third (LCC68, 300-mil cavity) is also a common MOSIS package. I suspect given the look of the die in each case, the lack of markings, and the missing lids that what you might have are a couple university prototypes, rather than commercial ICs.
No idea about the HTI chip.
- CMW |
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tlccomp
Joined: 11 May 2006
Posts: 1212
Location: Southeast Wisconsin, USA
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| Posted: Sun Aug 13, 2006 7:38 am Post subject: |
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| chip68 wrote: | The third (LCC68, 300-mil cavity) is also a common MOSIS package. I suspect given the look of the die in each case, the lack of markings, and the missing lids that what you might have are a couple university prototypes, rather than commercial ICs.
No idea about the HTI chip.
- CMW |
Interesting, thanks.  |
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