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Wizzard1
Joined: 05 Nov 2006
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Location: Boston MA USA
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 Posted: Wed Feb 20, 2008 10:21 pm Post subject: Largest die/package ratio? Smallest? |
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Jut browsing the forums, saw how much silicon was on the package for the Turion X2...
http://www.cpu-world.com/Images/uploaded/0000/05/L_00000517.jpg
Are there packages out there with MORE silicon? Less border?
How about LESS? Huge package, spec of sand? 
I'd like to see common/consumer products, not so much server stuff |
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Mixeur
Joined: 06 Jan 2005
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Location: Sochaux, France
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Wizzard1
Joined: 05 Nov 2006
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Location: Boston MA USA
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| Posted: Fri Feb 22, 2008 6:20 pm Post subject: |
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| I saw that one a while ago When are they going to start mounting the silicon on an equally small PCB? |
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gshv
Joined: 01 Feb 2003
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| Posted: Fri Feb 22, 2008 10:31 pm Post subject: |
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Mobile Celeron/Mobile Pentium II also has pretty big die when compared to chip size:
If I'm not mistaken, mobile K6-2 in BGA package also has big die (compared to package size).
Gennadiy |
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debs3759
Joined: 18 Jan 2006
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| Posted: Sat Feb 23, 2008 4:09 am Post subject: |
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Yes, you are right 
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Heartbreak one
Joined: 19 Dec 2007
Posts: 130
Location: Mandal, Norway
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| Posted: Sat Feb 23, 2008 4:50 am Post subject: |
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| Wow, that C2D for the MacBook Air has a small package! |
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gshv
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thomsonicus
Joined: 11 Dec 2007
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Location: Poland
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| Posted: Sat Feb 23, 2008 12:33 pm Post subject: |
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ATI RV350 chip has quite a border but thats a gpu
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Wizzard1
Joined: 05 Nov 2006
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Unzlbunzl
Joined: 30 Jan 2007
Posts: 468
Location: Graz, Austria
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| Posted: Sat Feb 23, 2008 1:58 pm Post subject: |
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| Quote: | | How about LESS? Huge package, spec of sand? Very Happy |
late piii xeon with 256k cache? |
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debs3759
Joined: 18 Jan 2006
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Location: Northampton, Divided Kingdom
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| Posted: Sat Feb 23, 2008 2:32 pm Post subject: |
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| Wizzard1 wrote: | | http://upload.wikimedia.org/wikipedia/commons/e/ef/Pentiumpro_moshen.jpg (maybe discounting the cache!) |
I'm now wondering whether you mean the CORE (which you can't see unless there is a UV Window, as in many MCUs with built-in EPROM). or the CORE CAP (heatspreader, core plate, etc - I'm never sure exactly what to call it, but you see it and it protects the core ). The Pentium Pro link show the core after the cap is removed. All other examples show the cap and not the core...
That would possibly make a difference to what sorts of answer you get
For example, all slot CPUs have a massive border, as the entire package is part of the processor, but the core is no larger than if it had been a regular socketed processor.
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Wizzard1
Joined: 05 Nov 2006
Posts: 930
Location: Boston MA USA
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| Posted: Sat Feb 23, 2008 5:13 pm Post subject: |
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I would discount the heatspreader, I'm talking ratio of silicon to package area.
The P3 Xeons and other slot processors have a 'standard' package size- I'd only count the little BGA portion mounted on the large PCB. |
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wepwawet
Joined: 18 Mar 2004
Posts: 3019
Location: Seligenstadt - Germany
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| Posted: Sun Feb 24, 2008 3:31 am Post subject: |
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absolutely: there are bigger dies.
relatively: that is the biggest I've ever seen.
upf, Genna was first with this |
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