Recently launched

October 2013:

AMD A10-6790K / 4GHz / 4MB L2 / 4 cores / Unlocked / Socket FM2 / Benchmarks

November 2013:

Intel Celeron J1800 / 2.41GHz / 1MB L2 / 2 cores / BGA1170
Intel Celeron J1900 / 2GHz / 2MB L2 / 4 cores / BGA1170
Intel Pentium J2900 / 2.41GHz / 2MB L2 / 4 cores / BGA1170

December 2013:

Intel Celeron G1820T / 2.4GHz / 2MB L3 / 2 cores / Socket 1150
Intel Celeron G1820 / 2.7GHz / 2MB L3 / 2 cores / Socket 1150 / Benchmarks
Intel Celeron G1830 / 2.8GHz / 2MB L3 / 2 cores / Socket 1150 / Benchmarks

January 2014:

A10-7700K / 3.4GHz / 4MB L2 / 4 cores / Unlocked / Socket FM2+
A10-7850K / 3.7GHz / 4MB L2 / 4 cores / Unlocked / Socket FM2+

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Last month, AMD launched Athlon X4 860K, the first GPU-less "Kaveri" microprocessor for socket FM2+. The chip comes with 4 "Steamroller" cores and disabled on-die GPU, while the rest of its features are identical to the A10-7850K APU. Another GPU-less processor, an FX-770K, has recently become available in HP Pavilion 500-422nl desktop computers, sold in Europe. Based on known characteristics, the FX-770K is similar to the A10-7800 APU, but lacks on-chip graphics, and has a clock multiplier unlocked.   [Full story]
New CPUs: AMD FX-770K
In June, we published some details of a graphics unit, integrated into future Skylake microprocessors. According to that report, Skylake chips will come with GT2, GT3e or GT4e GPUs, built on 9th generation graphics architecture, and "e" units will be coupled with up to 128 MB of eDRAM memory for extra performance. The GT4e GPU, obviously, is the fastest one, and it will be accompanied by 64MB embedded DRAM on quad-core LGA1151 CPUs, or 128 MB eDRAM on "H" line of BGA processors. GT4e graphics will utilize 72 execution units (EUs), that is 50% more than the best Broadwell GPU, which has 48 EUs.   [Full story]
In June, we published an article, describing features of unreleased Skylake mobile processors. Similar to Haswell and Broadwell-based chips, Skylake products will be available as "H" performance CPUs, "U" ULV systems on a chip for ultrabooks and thin-and-light notebooks, and "Y" extremely low power SoCs for fanless mobile devices, such as tablets and hybrid computers. Within each category, Intel plans from 4 to up to about 15 SKUs, that will differ by the number of cores, frequency, cache size, graphics type, Vpro support and Thermal Design Power.   [Full story]
This month, Intel quietly launched "Bay Trail"-based Atom E3805 system-on-a-chip for embedded market. Current generation of Atom E3800 series SoCs, codenamed Bay Trail-I, consists of E3815, E3825, E3826, E3827 and E3845 SKUs. The processors are manufactured on 22nm technology, and integrate from 1 to 4 cores depending on SKU, 7th generation HD graphics, DDR3 memory controller, and chipset logic. The embedded Atoms boast ultra low power consumption, ranging from 5 Watt to 10 Watt.   [Full story]
AMD prepares to launch next generation of mobile Accelerated Processing Units, codenamed Carrizo. According to Digitimes, current Kabini and Beema low power systems-on-a chip will be succeeded with "Carrizo-L" APUs, that will be positioned against Intel Celeron and Pentium entry-level CPUs for notebooks. AMD also plans to replace current mobile Kaveri products with quad-core "Carrizo" APUs.   [Full story]
Intel introduced Broadwell microarchitecture and first "Y" series Broadwell processors last month. Branded as Core M, the "Y" products have 2 CPU cores, greatly improved graphics unit, and extremely low power consumption, which allows the chips to be used in fanless mobile devices. More Broadwell microprocessors, this time from "U" series and with higher 15 Watt TDP, will be available in the first quarter of 2015. Based on slides, posted by VR-Zone Chinese Edition, Intel plans 17 new processors.   [Full story]
In September, AMD refreshed FX-Series line of high performance CPUs for socket AM3+ platform. The company officially announced three SKUs, including new flagship FX-8370, and two energy efficient microprocessors, FX-8320E and FX-8370E. Some pre-launch reports also mentioned FX-8310 model, that was apparently a bit faster version of the FX-8300. Specifications of this processor has been recently published by AMD, which confirmed that it was also released in September.   [Full story]
New CPUs: AMD FX-8310
AMD prepares two new processors for socket AM1 platform. Currently, there are four dual- and quad-core Accelerated Processing Units for the socket. All of them are based on low power Kabini core, that integrates CPU cores, a memory controller, graphics and Fusion Controller Hub on a chip. According to MSI and ASRock CPU support lists, AMD now plans two GPU-less versions of Kabini processors. The CPUs will be branded as Athlon X4, and they will have model numbers 530 and 550.   [Full story]
Earlier this month, Intel introduced first Haswell based Xeon microprocessors, codenamed Haswell-EP, for single- and dual-socket servers and workstations. The Xeon chips featured better performance per clock, more cores and cache, and support for DDR4 memory, while staying within same power limits as the previous generation of E5-1600 and E5-2600 processors. Additionally, the Haswell-EP lineup was expanded to include models, optimized for specific market segments.   [Full story]
NVidia launched the GeForce GTX 980 and GTX 970 graphics cards. Based on the Maxwell architecture, first seen with the release of the GeForce GTX 750 and GTX 750 Ti for the lower end of the mainstream market in February of this year, they introduce the GM204 GPU for the enthusiast market. The GTX 980 and GTX 970 graphics cards replace the GTX 780 and GTX 770 SKUs in the enthusiast and mainstream markets.   [Full story]
Last week at the IDF event in San Francisco, Intel revealed some details of upcoming Xeon products for cloud and dense data center environments. The processors will be branded as Xeon D. Formerly codenamed as BDW-DE, new server microprocessors will be implemented as systems-on-a-chip (SoC), integrating "Broadwell" CPU cores and a handful of I/O interfaces, including 10GB Ethernet. The Xeon Ds will be capable to run 64-bit applications, and support ECC memory. The processors are sampling now, and more information about them will be available later this year.   [Full story]
Intel Xeon E5-2600 v3 processors debuted this week, and they came with several new performance, energy efficiency and security features. One of the new features is support for DDR4 memory, that, according to Intel, helped to increase maximum memory bandwidth by up 1.4 times over the previous generation of Xeons. The DDR4 memory, while faster, is also more expensive, and for more budget conscious business clients Intel also prepared several Xeon E5 CPUs that support more common DDR3 memory.   [Full story]
There have been various rumors recently surrounding NVidia's next generation graphics cards. There is now enough solid information to warrant our writing about them. First off, a few days ago videocardz.com posted a graph showing 3DMark benchmark scores for the GTX 970 and GTX 980 against a number of competing cards. Then another site leaked some screenshots, which include a GPU-Z screenshot of the GTX 970, revealing much more info.   [Full story]
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